Hot Melt Adhesive Tape B6808

产品描述

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Hot Melt Adhesive Tape B6808　【More details】

　　 BOYUAN

◆Brief Introduction:

BOYUAN Hot Melt Adhesive Tape B6808 is special developed for encapsulating IC card. With excellent bonding strength, anti-torsion performance and aging resistance. It is fully compatible to encapsulate module to PVC or ABS card.

◆Structure：

Structure	composition	color	Thickness（μm）
Glue Layer	Modified Polyamide	Semi_transparent	55±5
Release Liner	Glassine Paper	Semi_transparent	70±5

◆Technical Parameters:

Item	Parameters
Pressure (MPa)	0.4~0.6
Pre_welding Temperature (℃)	140~160
Pre_welding Time (s)	0.5~0.6
Encapsulation Temperature (℃)	150~170
Encapsulation Time (s)	0.8~1.2
Bonding Strength (N)	＞100
Torsion Test (time) GB/T 17554.1-2006	＞2000

◆Packing:

Outer：Carton Inner：PE bag

◆Storage:

Keep package sealed, 0~30℃, ≤60% RH, Avoid direct sunlight.

Shelf life: two years.

◆Notice:

Gentle load, No press.

In order to avoid overflow and poor bonding strength please choose the proper parameters according to your machine setting.

！The information is based on our practical production andresult of testing. We suggest testing should be necessary before a batch use.We announce that the specification can not be used as the guarantee of the products.

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