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  • 产品名称: Hot Melt Adhesive Tape B6806

  

◆Brief Introduction:

BOYUAN Hot Melt Adhesive Tape B6808 is special developed for encapsulating IC card. With excellent bonding strength, anti-torsion performance and aging resistance. It is fully compatible to encapsulate module to PVC or ABS card.

◆Structure:

Structure

composition

color

Thickness(μm)

Glue Layer

Modified Polyamide

Semi-transparent

55±5

Release Liner

Glassine Paper

Semi-transparent

70±5

◆Technical Parameters:

Item

Parameters

Pressure (MPa)

0.4~0.6

Pre-welding Temperature (℃)

140~160

Pre-welding Time (s)

0.5~0.6

Encapsulation Temperature (℃)

150~170

Encapsulation Time (s)

0.8~1.2

Bonding Strength (N)

>100

Torsion Test (time)
GB/T 17554.1-2006

>2000

◆Packing:

Outer:Carton     Inner:PE bag

◆Storage:

Keep package sealed, 0~30℃, ≤60% RH, Avoid direct sunlight.

Shelf life: two years.

◆Notice:

  Gentle load, No press.

In order to avoid overflow and poor bonding strength please choose the proper parameters according to your machine setting.


!The information is based on our practical production and result of testing. We suggest testing should be necessary before a batch use.We announce that the specification can not be used as the guarantee of the products.